以下为句子列表：
英文: Abstract: Although optoelectronics imaging systems asvideo-sets,low light level and thermal imaging systems have been widely used for militaryand civil purposes, the matching between optoelectronics imaging systems and human visionremains to be a common p
中文: 文摘:以电视、微光成像和热成像系统为代表的光电成像系统在军事和民用上有着广泛的用途，但光电成像系统与人眼视觉的匹配问题仍是按现有理论和方法难以准确解释或定量描述的普遍问题。
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英文: C. C. Lee and M. C. Liu , Optical Thin Film for Lithography, The 11th OptoElectronics and Communications Conference, July 3-7 Kaohsiung, Taiwan. 6C2-1, (2006).
中文: 江政忠,李正中,刘旻忠,沈威廷,卓文浩,室温斜向制镀氟化镁薄膜微结构与应力之探讨,2006材料年会,成功大学,台湾,(2006).
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英文: CHANG Jun, Liu Tong-yu2, Wang Qing-pu, Zhang Xing-yu, Wang Qian, Ma Liang-zhu, Li Yong-fu, Wang Hong-chun, Single-end Fiber Optic Vibration Sensor Based on Over-coupled Fused Coupler, Optoelectronics Letters, Accepted.
中文: 常军，王青圃，张行愚，刘统玉，马良柱，李永富,过度耦合融熔双锥型单端光纤振动传感器,光电子?激光，已接收，2006.
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英文: Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
中文: 摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
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英文: In this paper, the nature ofthis problem is exemplified theoretically, showing that a system optimal matching existsin the matching system, and the conditions of matching affect directly the overall designsof optoelectronics imaging system.Some explanatio
中文: 从理论上阐述了此问题的本质，说明了在这种匹配系统中存在系统的最佳匹配，且匹配状况直接影响光电成像系统的总体设计，并对如何描述这种关系进行一些说明和分析。
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