以下为句子列表:
英文: During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.
中文: 在下一个回流工序,锡膏浸润焊盘表面,形成一个固态锡膏凸起。
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英文: With the trend toward miniaturization, solder bumps are getting smaller, and the electric current loading of each solder bump is getting higher.
中文: 随著电子产品之微小化,焊料凸块的尺寸越来越小,而焊料凸块的电流密度也随之增大。
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