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flip chip
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【计】 倒装法
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分类:
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详细解释:
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以下为句子列表:
英文: As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
中文: 当电流通过焊点时,会伴随产生焦耳热效应和电迁移效应。
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英文: Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
中文: 完成某集成电路封装(叩焊芯片)内部实际的电气连接的焊料中的铅。
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英文: Flexible Bumping Technology and Applications in MEMS Flip Chip Packaging
中文: MEMS器件倒装芯片封装中的柔性化凸点制备技术及其应用
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