以下为句子列表：
英文: In this process, a standard stencil printing technique is used to print solder paste directly onto silicon wafers (Figure 4).
中文: 在这个过程，标准印刷技术用来把锡膏直接印刷到硅晶片上。
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英文: It is concluded that through the examples of stencil printing and electroplating wafer bumping describe the current status of lead-free alternatives for advanced interconnection technology,reliable lead-free technologies are available.
中文: 从而说明，通过漏印板印刷和电镀的晶圆片凸点形成技术事例，证明可靠的无铅化技术是适合的。
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