以下为句子列表：
英文: 11 An, M.-Z. The Electroplating Theory And Technique, the Press of Harbin Institute of Technology, Harbin, 2004 , p. 192 (in Chinese).
中文: 安茂忠编,电镀理论与技术,哈尔滨工业大学出版社,哈尔滨,2004,p.192.
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英文: A review is given on the electrodepositing mechanism of copper from sulfate bath and on the microstructure of the copper coating, the effect of additives on the electroplating process, as well as the research progress concerning copper electrodepositing.
中文: 摘要铜的性质决定了铜在工业应用中的重要性，特别是目前在微电子工业中的决定性作用，使铜的电沉积过程成为研究热点。
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英文: Abstract: Development of zinc-cobalt alloy electroplating was reviewed. Factors affecting cobalt content of alloy deposit in acidic chloride system were analyzed.
中文: 文摘:概述了锌钴合金电镀的研究现状与发展概况。重点介绍了氯化物体系，分析了影响镀层钴含量及性能的各因素。
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英文: Abstract: The application of methanesulfonate of metals in electroplating and electrobruch plating was studied. It would be expected to employ in industries.
中文: 文摘:研究了甲基磺酸盐在电镀和电刷镀技术中的应用，显示出良好的推广应用前景。
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英文: Abstract: The article summarises the technical specifications, process parameters and operating characteristics of some special printing pastes for PCB, including photoresist solution, electroplating resist paste, solder resist, character release paste, p
中文: 文摘:简述了印制电路板生产用的专用印料：抗蚀刻印料，抗电镀印料，阻焊印料，字符、标记印料，塞孔印料，导电印料，可剥性印料，焊膏印料等各类印料的技术规范、工艺参数和生产操作技术。
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