以下为句子列表：
英文: 11 An, M.-Z. The Electroplating Theory And Technique, the Press of Harbin Institute of Technology, Harbin, 2004 , p. 192 (in Chinese).
中文: 安茂忠编,电镀理论与技术,哈尔滨工业大学出版社,哈尔滨,2004,p.192.
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英文: A review is given on the electrodepositing mechanism of copper from sulfate bath and on the microstructure of the copper coating, the effect of additives on the electroplating process, as well as the research progress concerning copper electrodepositing.
中文: 摘要铜的性质决定了铜在工业应用中的重要性，特别是目前在微电子工业中的决定性作用，使铜的电沉积过程成为研究热点。
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英文: Abstract: Development of zinc-cobalt alloy electroplating was reviewed. Factors affecting cobalt content of alloy deposit in acidic chloride system were analyzed.
中文: 文摘:概述了锌钴合金电镀的研究现状与发展概况。重点介绍了氯化物体系，分析了影响镀层钴含量及性能的各因素。
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英文: Abstract: The application of methanesulfonate of metals in electroplating and electrobruch plating was studied. It would be expected to employ in industries.
中文: 文摘:研究了甲基磺酸盐在电镀和电刷镀技术中的应用，显示出良好的推广应用前景。
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英文: A RAPID METHOD FOR THE DETERMINATION OF MINUTE QUANTITY OF SILVER IN ELECTROPLATING WASTE LIQUOR——The Elimination of Cyanic Ion Interference by Catalytic Oxidation Method
中文: 测定银氰电镀废液中微量银的研究——用催化氧化法消除氰的干扰
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