英汉双语例句-生物医药大词典

In a meek or humble manner.

中文意思：
谦逊的以一种谦卑或温顺的方式

以下为相关句子列表(点击查看，可以看对应的解释）：

	In a matter of five minutes, the Heat went from drafting a potential backup power forward in Smith to landing Cook, who was regarded as one of the draft's better shooters.			在约5分钟内，热火新秀从一个大前换到了一个得分后卫，该后卫被认为是今年新秀中最好的射手之一。
	In a medium bowl, combine orange, grapefruit, scallions, tomatoes, remaining tablespoon each lime juice and olive oil, zests, salt and pepper, diced jalape?o, cilantro and tomatillos. Set aside.			取一只中等的碗，放入橘子，柚子，大葱和小西红柿，剩下的一大汤匙的酸橙汁和一大汤匙橄榄油，盐和胡椒粉，切片的墨西哥胡椒，芫荽叶和粘果酸浆，搅拌。
	In a medium bowl, combine peaches, blackberries, strawberries, honey and cardamom. Toss together and refrigerate.			在一个中号碗中,将桃子,黑霉,草莓,蜂蜜和斗粉搅拌,摇匀,冷藏.
	In a medium bowl, combine the currants, breadcrumbs, mint, and minced garlic. Season well with salt and pepper.			在一中碗内混和红醋栗、面包糠、薄荷及蒜蓉，以盐及胡椒调味。
	In a medium saucepan, heat 1 tablespoon olive oil over medium-high heat.			取一只中等炖锅，放入橄榄油，中高火加热。
	In a meek or humble manner.			谦逊的以一种谦卑或温顺的方式
	In a member function definition, the declaration of a local name hides the declaration of a member of the class with the same name; see 3.3.6.			在成员函数定义中，局部名字的声明隐藏类成员相同名字的声明；参见3.3.6。
	In a memoir, “The Summer of Ordinary Ways,” the Minnesota writer Nicole Lea Helget described her childhood on a family farm.			在《夏天的平凡生活》这本回忆录中，明尼苏达的作家妮可?黎?赫杰描述她在家族农场的童年生活。
	In a metamaterial, the patterned elements are considerably smaller than the wavelength and are thus not seen individually by the electromagnetic wave.			在超材料中，组成图案的元件通常比电磁波长小很多，因此电磁波看不见个别的组成元件。
	In a micro hybrid or a start-stop hybrid, such as those being introduced by General Motors, the engine shuts down when the car comes to a halt, and an integrated starter-generator fires up the engine instantly when the driver steps on the gas pedal.			通用汽车等公司推出的微量级混合车，又称为起止混合车，引擎会在汽车停止前进时熄火，驾驶人踩下油门时，整合式启动发电机立刻发动引擎。
	In a microcircuit, the supporting material upon which or with in which an integrated circuit is fabricated, or to which an integrated circuit is attached.			微电子电路中的支承材料,在其上或其内制作集成电路,或者将集成电路附着在这些支承材料上。