英汉双语例句-生物医药大词典

Chemical residue from artificial fragrances commonly used in other personal care products may cause skin irritation, eczema and may be hazardous to our health.

中文意思：
个人护理产品中普遍加入人造香味，化学成分的残余物会引致皮肤过敏、湿疹，甚至会危害我们的健康。

以下为相关句子列表(点击查看，可以看对应的解释）：

	Chemical lab experience is necessary.			有化学实验室工作经验。
	Chemical mechanism on formation of secondary organic aerosols involves in photooxidation process of volatile organic compounds and subsequent chemical reaction, which directly lead to increase of ozone concentration and to formation of secondary organic a			二次有机气溶胶形成的化学机理主要涉及到挥发性有机化合物的光氧化过程及其一系列的后续反应，它们导致了对流层中臭氧浓度的增加和二次有机气溶胶的形成。
	Chemical pipes, tanks, meter pipes: thermal insulation.			化工管道、罐体、仪表管线的伴热保温。
	Chemical process equipment degree Preferable or Electrical Technician/Engineering degree (3 years university minimum), plus, 3 years experience in chemical plant.			大专以上学历，在化工厂有三年以上相关工作经验，化学工艺设备或电气工程专业优先。
	Chemical reactions would not do the trick, because all isotopes are chemically identical.			不可能是化学反应，因为所有同位素的化学性质都一样。
	Chemical residue from artificial fragrances commonly used in other personal care products may cause skin irritation, eczema and may be hazardous to our health.			个人护理产品中普遍加入人造香味，化学成分的残余物会引致皮肤过敏、湿疹，甚至会危害我们的健康。
	Chemical sensors turn a solution bright green if anthrax is present and then trigger an alarm.			如果有炭疽，化学传感器就会出现溶液变明绿色，接着就响铃。
	Chemical treatments (soaking seeds in 15% H2O2 for 30min or in 75% ethanol for 30s) before stratification were not more effective than the control in breaking seed dormancy.			另以15%H2O2浸泡30分钟及75%酒精浸泡30秒钟之药剂处理后再进行低温或组合层积，其删除种子休眠效果均逊于控制组（未经药剂处理者）。
	Chemical weapons are abundant in variety.			化学武器种类繁多。
	Chemical, physical or biological contaminants that have or may have or have potential hazardous effect on human health, including pathogens, pests, pesticide and drug residues, heavy metal residues, toxins, and animal-derived food products non-compliant w			存在或可能存在风险及存在潜在危害的具有化学、物理、生物性污染，这些污染包括病原微生物、病虫害、农兽残、重金属残留、毒素等，以及不符合标签规定的进出口动物源性食品等。
	Chemical-Mechanical Polish (CMP) - A process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.			化学-机械抛光(CMP)-平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。