以下为句子列表：
英文: By using a wafer-rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material r
中文: 摘要利用基于自旋转磨削原理的矽片超精密磨床，通过试验研究了砂轮粒度、砂轮转速、工件转速及砂轮进给速度等主要因素对材料去除率、砂轮主轴电机电流以及磨削后矽片表面粗糙度的影响关系。
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